TFE（Thin Film Encapsulation）

✔ Able to do inkjet without solvent. (Adhesive is non-solvent.)

✔ Able to apply thin film layer, particle covered layer, Stress relaxation layer.

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Temporary fixation material endures 450℃（OCG）

✔ Temporary fixation material endures 450℃.Able to have adhesion.

✔ No zipping during peeling off which provides no damage to device and improve yield point.

✔ There is no need for the use of multiple fixation material or tapes depending on the heating terms.

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Electro-wire, edge reinforcement.

✔ High elasticity & High elongation adhesive.

✔ Non-tackiness & able to apply coating part.

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