Concept of Developed Products
When a sheet-fed process is used to advance film formation and thin film formation, temporary fixation with carrier glass may be required.The concept is easy to design in a process that takes into account the louse and louse processes.
- High heat resistance ⇒ High heat resistance up to 450°C in the manufacturing process
- Peelable ⇒ Can be peeled depending on the combination of components as well as adhesive.
- No zipping during peeling ⇒ Avoid concentration of stress at a certain point during peeling
Technical Data
Item |
OCG |
Appearance |
White liquid |
Materials |
Silicone |
Viscosity(mP・s) |
4,00~8,300 |
Curing method |
UV+ heat |
Hardness(D) |
75 |
Tg(℃) |
43 |
Tensile modules of elasticity(MPa) |
0.65 |